lsir3333r/s280/a-pf 21 - jun. b doc. no : qw0905- rev. : date : - 2016 data sheet lsir3333r/s280/a-pf infrared emitting diodes ligitek electronics co.,ltd. property of ligitek only pb lead-free parts l dcc
package dimensions note : 1.all dimension are in millimeter tolerance is
electrical optical characteristics (aa=25) ligitek electronics co.,ltd. property of ligitek only symbol ratings parameter 2000 electrostatic discharge esd operating temperature storage temperature -40 ~ +85 -40 ~ +85 t opr tstg peak forward current (300pps,10 s pulse) reverse voltage forward current power dissipation vr i f pd i fp absolute maximum ratings at ta=25 unit v v ma mw a note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the radiant intensity data did not including 15% testing tolerance. sir(r) 5 100 1 100 radiant intensity aperture radiant incidence peak emission wavelength spectral line half width forward voltage reverse current viewing angle parametersymbol unittest condition if=100ma lemw/sr eemw/cm peak nm nm vfv na 2 1/2 deg 2 if=100ma if=100ma if=100ma if=100ma min. typ. max. 50 75 7.1410.7 890 50 1.41.7 100 40 page2/8 lsir3333r/s280/a-pf part no. reverse light current ir 10 a e e =1mw/cm 2 , = 870 nm,v r = 5v ira vr=5v
radiant intensity(mw/sr)at 100 ma a20105 brightness code for standard led lamps sir(r) chip a18 a19 a16 a17 75 85 50 60 group min. 125 85 105 60 75 max. lsir3333r/s280/a-pf part no. page ligitek electronics co.,ltd. property of ligitek only 3/8
fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage(v) fig.relative intensity vs. temperature wavelength(nm) fig.2 relative intensity vs. forward current fig.1 forward current vs. rorward voltage typical electro-optical characteristics curve sir(r) chip lsir3333r/s280/a-pf part no. ligitek electronics co.,ltd. property of ligitek only 4/8 page
cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. storage time: 1.the operation of temperatures and rh are : 5 ?
anode side(cathode side on gaalas chips) 2. the led lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 45
50 60 seconds max dip soldering preheat: 120
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test solder resistance test this test intended to see soldering well performed or not. 1.t.sol=260
3. 12 inner boxes / carton size : l x w x h 58.5cm x 34cm x 34cm l w c/no: made in china h i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s 1.500 pcs / bag l 2. 8bag / inner box size : l x w x h 33.5cm x 19cm x 7.5cm w h packing specification
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